Posted on October 12, 2017

Low-Temperature Co-Fired Ceramic (LTCC)

Low-Temperature Co-Fired Ceramic (LTCC) packaging technology is ideal for high-frequency electronics applications and high-reliability designs required in harsh operating environments.

LTCC packaging technology offers many advantages such as:

  • Multi-layered structure for reduced package size.
  • Buried passive components that offer up to 50% size reduction compared to PCBs.
  • Three-dimensional proprietary circuit design that protects intellectual property.
  • The ability to withstand extreme operating temperatures from -170 C to +350 C.
  • Stability and low-loss in high-frequency applications up to 60 GHz.

Common LTCC applications include:

  • Conventional energy, health and medical, cleantech, agriculture and forestry.
  • High-temperature electronics.
  • High-frequency wireless applications.
  • Optoelectronics.

ACAMP offers complete design, assembly, testing and manufacturing services for LTCC packaging.

To learn more, please contact us at, +1-780-468-2443 or +1-403-291-8946.